Xingshan terminal is accelerating to market, how to choose the right Xingshan So

Electronic Enthusiast Network reports that as a new generation of close-range wireless connection technology, the ecological development of StarFlash has been visibly rapid this year. By offering transmission rates and connection stability that surpass Bluetooth, we can see that since the beginning of this year, many brands and products in areas such as mice, keyboards, gaming controllers, and remote controls have supported StarFlash connections and have received positive market feedback.

The expansion of applications also requires support from the upstream chip end. Currently, there are already many wireless SoCs on the market that support StarFlash, and several chip manufacturers are also in the research and development phase of StarFlash wireless SoCs. Below is a roundup of the StarFlash SoC products that have been launched on the market so far.

Advertisement

HiSilicon

On the HiSilicon official website, there are currently two major series of StarFlash SoCs, namely Hi38XX and Hi28XX. The Hi38XX series all support WiFi6, among which Hi3873V100 is a broadband transparent Wi-Fi 6, BLE, StarFlash multi-mode chip, suitable for IP Camera, FHD and 4K entry-level smart TVs, StarFlash Bluetooth fusion gateways, and other constantly powered IoT smart scenarios.

As a multi-mode wireless SoC, Hi3873V100 integrates the IEEE 802.11 b/g/n/ax baseband and RF circuit, including power amplifier PA, low noise amplifier LNA, RF balun, antenna switch, and power management module, etc.; it also integrates a CPU subsystem, equipped with a high-performance 32-bit MCU, with a maximum working frequency of 240MHz, embedded SRAM 300KB, ROM 430KB; supports 802.11n 20MHz/40MHz bandwidth, supports 802.11ax 20MHz bandwidth, provides a maximum physical layer rate of 150Mbps, supports larger transmission power and longer coverage distance; supports BLE 1MHz/2MHz bandwidth, supports BLE4.0/4.1/4.2/5.0/5.1/5.2 protocols, supports BLE Mesh and BLE gateway functions, with a maximum air interface rate of 2Mbps; supports StarFlash SLE 1MHz/2MHz/4MHz bandwidth, supports SLE1.0 protocol, supports SLE gateway functions, with a maximum air interface rate of 12Mbps.

Hi3863V100 is a 2.4GHz, Wi-Fi 6, BLE, StarFlash multi-mode IoT SoC chip, which also includes an enhanced chip Hi3863EV100, adding support for 2.4GHz radar human activity detection. These two chips are suitable for home appliances, electrical lighting, and constantly powered IoT smart scenarios that require human presence detection.

The Hi3863V100 series integrates the IEEE 802.11 b/g/n/ax baseband and RF circuit, including power amplifier PA, low noise amplifier LNA, RF balun, antenna switch, and power management module, etc.; the CPU subsystem includes a high-performance 32-bit MCU with a maximum working frequency of 240MHz, embedded SRAM 606KB, ROM 300KB, and 4MB Flash; supports 20MHz bandwidth, provides a maximum physical layer rate of 114.7Mbps, supports larger transmission power and longer coverage distance; supports BLE 1MHz/2MHz bandwidth, BLE4.0/4.1/4.2/5.0/5.1/5.2 protocols, BLE Mesh and BLE gateway functions, with a maximum air interface rate of 2Mbps; supports StarFlash SLE 1MHz/2MHz/4MHz bandwidth, SLE1.0 protocol, supports SLE gateway functions, with a maximum air interface rate of 12Mbps.

The Hi28XX series currently has two known chips, Hi2825V100 and Hi2821, mainly used in VR controllers/gaming keyboards/mice and other HID peripherals, as well as consumer electronics such as PCs/tablet/TV/set-top boxes. Currently, only Hi2825V100 is temporarily available on the official website.

Hi2825V100 is a highly integrated 2.4GHz BLE/SLE SoC solution, integrating high-performance, ultra-low-power BLE5.4, SLE1.0, and RF circuits, including power amplifier PA, low noise amplifier, antenna, and power management modules. StarFlash SLE supports 1M/2M/4M three bandwidths, with a maximum physical layer rate of 8Mbps. Hi2825V100 also integrates a high-performance 32-bit RISC-V MCU, with a working frequency of 96MHz, built-in 512KB SRAM and 1MB Flash, and supports running programs on Flash, supports hardware security engines, and has a rich set of peripheral interfaces. Peripheral interfaces include USB2.0 HighSpeed, SPI, UART, I2C, PWM, GPIO, PDM, I2S/PCM, supporting 8 channel 12bit 4Msps SAR ADC and 1 channel 16bit 1Msps SAR ADC.

Hi2821 is currently used in some StarFlash modules. This is a highly integrated 2.4GHz SoC BLE&SLE chip, integrating a 32-bit RISC-V MCU, with a working frequency of 64MHz, embedded 160KB SRAM, 512KB Flash; supports BLE5.4/SLE1.0, integrates RF circuits, RF includes power amplifier PA, low noise amplifier, TX/RX Switch, integrated power management modules, supports 1M/2M/4M three bandwidths, with a maximum rate of 12Mbit/s.Aiqi Technology

Founded in December 2020, Aiqi Technology is headquartered in Chengdu. The core team members all have over 10 years of experience in the chip industry, consisting of industry leaders in analog, RF, digital, firmware, and software. They have a successful mass production experience with more than ten SoC projects and over 100 million chips shipped. As early as last year's Harmony OS Connect Partner Summit, Aiqi Technology showcased several Xingshan wireless MCUs.

Currently, there are three Xingshan chips on Aiqi Technology's official website: AiW9761, AiW9651, and AiW9452. The AiW9761 is a highly integrated multi-mode chip with 2.4GHz WiFi, BLE, and SLE, integrating the IEEE 802.11b/g/n/ax baseband and RF circuit, including power amplifier PA, low noise amplifier LNA, RF balun, antenna switch, and power management module, etc.; it supports 20MHz/40MHz bandwidth, providing a maximum physical layer rate of 150Mbps and longer coverage distance; it supports BLE5.2 and SLE1.0 protocols, suitable for applications in the transparent transmission field such as vehicle recorders, IPC, FHD TVs, sweeping machines, printers, drones, etc.

The AiW965 is a multi-mode chip integrated with 2.4GHz, BLE, and SLE, without WiFi support, integrating RF circuits, including power amplifier PA, low noise amplifier LNA, RF balun, antenna switch, and power management module, etc.; it supports BLE 1MHz/2MHz bandwidth, supports BLE 5.2 protocol, supports BLE Mesh and BLE gateway functions, with a maximum air interface rate of 2Mbps; it supports SLE 1MHz/2MHz/4MHz bandwidth, supports SLE1.0 protocol, supports SLE gateway functions, with a maximum air interface rate of 12Mbps. Suitable for applications in gateways, smart industry, smart agriculture, and industry wireless replacing wired fields.

The AiW9452 is a highly integrated SoC chip with 2.4GHz, BLE & SLE, integrating BLE5.4/SLE1.0 and RF circuits, RF circuits including power amplifier PA, low noise amplifier, TX/RX Switch, integrated power management, etc.; it supports BLE 2MHz bandwidth, supports BLE5.4 protocol, supports BLE Mesh and BLE gateway functions, with a maximum support rate of 2Mbit/s; it supports SLE 1MHz/2MHz/4MHz bandwidth, supports SLE1.0 protocol, supports GFSK frame and low latency frame, supports SLE gateway functions, with a maximum support rate of 12Mbit/s. The AiW9452 also integrates a high-performance RISC-V MCU and security processing engine; it integrates a rich set of interfaces, including I2C/SPI/PWM/USB/GPIO, supports USB2.0 interface, with a maximum rate of 480Mbps; it supports QDEC function, KeyScan function, NFC Type2 Tag function, and supports ADC multiplexing for audio AMIC sampling. Suitable for applications in keyboards, mice, microphones, speakers, remote controls, car keys, industry wireless replacing wired fields.

Innolight Technology

Innolight Technology is also one of the first chip companies to launch Xingshan chips. Currently, its Xingshan chip product line includes two major series: SLE and SLB.

The SLE series currently has one product, TR5312, which is a Xingshan SLE & Bluetooth BLE dual-mode SoC chip, supporting 2.4GHz private protocol as well as Xingshan SLE1.0 and Bluetooth BLE5.4. The TR5312 integrates MAC, Baseband, RF (including Transceiver, Balun, PA, LNA, TX/RX switch), and other modules to support external LNA connections, supporting 1M/2M/4M three bandwidths, with a maximum rate of 8Mbps.

The SLB series mainly includes TE5330, which is a multi-mode chip integrated with 2.4GHz Wi-Fi6, SLE, and BLE, integrating IEEE802.11b/g/n/ax baseband and RF circuits, including power amplifier (PA), low noise amplifier (LNA), RF balun, RF switch, and power management module, etc. It also integrates a high-performance 32-bit MCU and security processing engine, suitable for IoT smart terminal fields such as IP Camera, vehicle recorders, smart phones, smart TVs, sweeping robots, drones, etc.

TE5330 supports SLE 1MHz/2MHz/4MHz bandwidth, supports SLE1.0 protocol, supports SLE gateway functions, with a maximum air interface rate of 12Mbps. TR5330 supports BLE 1MHz/2MHz bandwidth, supports BLE 4.0/4.1/4.2/5.0/5.1/5.2/5.4 protocols, supports BLE Mesh and BLE gateway functions, with a maximum air interface rate of 2Mbps.TE5330 comes in two versions: TR5330S and TR5330U. The TR5330S supports the high-speed SDIO 2.0 interface with a maximum clock rate of 50MHz and provides 15 GPIO interfaces; the TR5330U supports the USB 2.0 interface with a maximum rate of 480Mbps and offers 2 UART and 14 GPIO interfaces.

In summary, from the perspective of the terminal market, Xingshan chips are currently being widely applied to game controllers, mice, keyboards, and other gaming peripherals. As the applications become more mature, Xingshan technology is expected to continue expanding into more fields in the future.